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2016 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP) (2016)
Austin, TX, USA
June 4, 2016 to June 4, 2016
ISBN: 978-1-5090-3092-7
TABLE OF CONTENTS

A comparative analysis of front-end and back-end compatible silicon photonic on-chip interconnects (Abstract)

Ishan G. Thakkar , Department of Electrical and Computer Engineering Colorado State University, Fort Collins, CO, U.S.A.
Sai Vineel Reddy Chittamuru , Department of Electrical and Computer Engineering Colorado State University, Fort Collins, CO, U.S.A.
Sudeep Pasricha , Department of Electrical and Computer Engineering Colorado State University, Fort Collins, CO, U.S.A.
pp. 1-8

Latch clustering for minimizing detection-to-boosting latency toward low-power resilient circuits (Abstract)

Chih-cheng Hsu , Department of Electrical Engineering, National Chung Cheng University, Chiayi, Taiwan
Mark Po-hung Lin , Department of Electrical Engineering, National Chung Cheng University, Chiayi, Taiwan
Masanori Hashimoto , Department of Information Systems Engineering, Osaka University, Suita-shi, Japan
pp. 1-6

Buffered interconnects in 3D IC layout design (Abstract)

Mohammad A. Ahmed , Portland State University, OR, USA
Sucheta Mohapatra , Portland State University, OR, USA
Malgorzata Chrzanowska-Jeske , Portland State University, OR, USA
pp. 1-8

Topologically-geometric routing (Abstract)

Roman Bazylevych , Lviv Polytechnic National University University of Information Technology and Management in Rzeszow 380506227536
Marek Pa?asinski , University of Information Technology and Management in Rzeszow 481786611 32
Lubov Bazylevych , Institute of Applied Problems of Mechanics and Mathematics NASU 380503702702
pp. 1-6

Revisiting 3DIC Benefit with Multiple Tiers (Abstract)

Wei-ting Jonas Chan , ECE Department, University of California, San Diego
Andrew B. Kahng , CSE Department, University of California, San Diego
Jiajia Li , ECE Department, University of California, San Diego
pp. 1-8

Spin-hall assisted STT-RAM design and discussion (Abstract)

Enes Eken , Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA
Ismail Bayram , Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA
Yaojun Zhang , Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA
Bonan Yan , Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA
Wenqing Wu , Qualcomm Inc., San Diego
Hai Li , Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA
Yiran Chen , Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA
pp. 1-4

A demand-aware predictive dynamic bandwidth allocation mechanism for wireless network-on-chip (Abstract)

Naseef Mansoor , Rochester Institute of Technology Rochester, NY, USA
Shahriar Shamim , Rochester Institute of Technology Rochester, NY, USA
Amlan Ganguly , Rochester Institute of Technology Rochester, NY, USA
pp. 1-8

[Front Matter] (Abstract)

pp. 1-2
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