The Community for Technology Leaders
2012 IEEE Hot Chips 24 Symposium (HCS) (2012)
Cupertino, CA, USA
Aug. 27, 2012 to Aug. 29, 2012
ISBN: 978-1-4673-8879-5
TABLE OF CONTENTS

Augmented reality (Abstract)

Ben Blachnitzky , Metaio, United States
pp. 93-103

Sensor fusion mobile platform challenges and future directions (Abstract)

Jim Steele , Engineering, Sensor Platforms, Inc., United States
pp. 104-114

Platform performance (Abstract)

pp. 115-128

Hot Chips: Stacking tutorial (PDF)

Choon Lee , Technology HQ, Amkor, United States
pp. 1

Optical backplanes with 3D integrated photonics? (Abstract)

Ephrem Wu , Xilinx, United States
pp. 1-20

Swizzle Switch: A self-arbitrating high-radix crossbar for NoC systems (Abstract)

Ronald Dreslinski , University of Michigan, United States
Korey Sewell , University of Michigan, United States
Thomas Manville , University of Michigan, United States
Sudhir Satpathy , University of Michigan, United States
Nathaniel Pinckney , University of Michigan, United States
Geoff Blake , University of Michigan, United States
Michael Cieslak , University of Michigan, United States
Reetuparna Das , University of Michigan, United States
Thomas Wenisch , University of Michigan, United States
Dennis Sylvester , University of Michigan, United States
David Blaauw , University of Michigan, United States
Trevor Mudge , University of Michigan, United States
pp. 1-44

ADI's revolutionary BF60x vision focused digital signal processor system on chip: 25 billion operations/sec @ 80 mW and zero bandwidth (Abstract)

Robert Bushey , Processor & Digital Signal Processing Core Products & Technologies Group, ADI, USA
pp. 1-24

Visconti2 - a heterogeneous multi-core SoC for image-recognition applications (Abstract)

Masato Uchiyama , Toshiba Corporation, Kawasaki, Japan
Hideho Arakida , Toshiba Corporation, Kawasaki, Japan
Yasuki Tanabe , Toshiba Corporation, Kawasaki, Japan
Tsukasa Ike , Toshiba Corporation, Kawasaki, Japan
Takanori Tamai , Toshiba Corporation, Kawasaki, Japan
Moriyasu Banno , Toshiba Corporation, Kawasaki, Japan
pp. 1-22

Centip3De: A 64-core, 3D stacked, near-threshold system (Abstract)

Ronald G. Dreslinski , University of Michigan, United States
David Fick , University of Michigan, United States
Bharan Giridhar , University of Michigan, United States
Gyouho Kim , University of Michigan, United States
Sangwon Seo , University of Michigan, United States
Matthew Fojtik , University of Michigan, United States
Sudhir Satpathy , University of Michigan, United States
Yoonmyung Lee , University of Michigan, United States
Daeyeon Kim , University of Michigan, United States
Nurrachman Liu , University of Michigan, United States
Michael Wieckowski , University of Michigan, United States
Gregory Chen , University of Michigan, United States
Trevor Mudge , University of Michigan, United States
Dennis Sylvester , University of Michigan, United States
David Blaauw , University of Michigan, United States
pp. 1-30

The future of wireless networking (Abstract)

Marcus Weldon , Alcatel-Lucent, France
pp. 1-24

Floating point processing using FPGAs (Abstract)

Michael Parker , Altera Corp, United States
pp. 1-31

An IA-32 processor with a wide voltage operating range in 32nm CMOS (Abstract)

Gregory Ruhl , Microprocessor & Programming Research, Intel Labs, United States
Saurabh Dighe , Microprocessor & Programming Research, Intel Labs, United States
Shailendra Jain , Microprocessor & Programming Research, Intel Labs, United States
Surhud Khare , Microprocessor & Programming Research, Intel Labs, United States
Satish Yada , Microprocessor & Programming Research, Intel Labs, United States
V Ambili , Microprocessor & Programming Research, Intel Labs, United States
Praveen Salihundam , Microprocessor & Programming Research, Intel Labs, United States
Shiva Ramani , Microprocessor & Programming Research, Intel Labs, United States
Sriram Muthukumar , Microprocessor & Programming Research, Intel Labs, United States
M Srinivasan , Microprocessor & Programming Research, Intel Labs, United States
Arun Kumar , Microprocessor & Programming Research, Intel Labs, United States
Shasi Kumar , Microprocessor & Programming Research, Intel Labs, United States
Rajaraman Ramanarayanan , Microprocessor & Programming Research, Intel Labs, United States
Vasantha Erraguntla , Microprocessor & Programming Research, Intel Labs, United States
Jason Howard , Microprocessor & Programming Research, Intel Labs, United States
Sriram Vangal , Microprocessor & Programming Research, Intel Labs, United States
Paolo Aseron , Microprocessor & Programming Research, Intel Labs, United States
Howard Wilson , Microprocessor & Programming Research, Intel Labs, United States
Nitin Borkar , Microprocessor & Programming Research, Intel Labs, United States
pp. 1-37

Medfield smartphone SOC Intel® Atom Z2460 processor (Abstract)

Rumi Zahir , Intel Corporation, United States
pp. 1-20

Cloud transforms it Big Data transforms business (Abstract)

Pat Gelsinger , Information Infrastructure Products, EMC Corporation, United States
pp. 1-30

POWER7+™ (Abstract)

pp. 1-17

SPARC64™ X: Fujitsu's new generation 16 core processor for the next generation UNIX servers (Abstract)

Takumi Maruyama , Processor Development Division, Enterprise Server Business Unit, Fujitsu Limited, Japan
pp. 1-20

IBM zNext - the 3rd generation high frequency microprocessor chip (Abstract)

Chung-Lung Shum , System z Processor Development, Systems & Technology Group, IBM Corp., United States
pp. 1-18

Prototyping the DySER specialization architecture with OpenSPARC (Abstract)

Jesse Benson , University of Wisconsin-Madison, United States
Ryan Cofell , University of Wisconsin-Madison, United States
Chris Frericks , University of Wisconsin-Madison, United States
Venkatraman Govindaraju , University of Wisconsin-Madison, United States
Chen-Han Ho , University of Wisconsin-Madison, United States
Zachary Marzec , University of Wisconsin-Madison, United States
Tony Nowatzki , University of Wisconsin-Madison, United States
Karu Sankaralingam , University of Wisconsin-Madison, United States
pp. 1-3

Low power and high performance 3-D multimedia platform (Abstract)

Po-Han Huang , Information and Communications Research Lab., Industrial Technology Research Institute, Hsinchu, Taiwan
Chi-Hung Lin , Information and Communications Research Lab., Industrial Technology Research Institute, Hsinchu, Taiwan
Hsien-Ching Hsieh , Information and Communications Research Lab., Industrial Technology Research Institute, Hsinchu, Taiwan
Huang-Lun Lin , Information and Communications Research Lab., Industrial Technology Research Institute, Hsinchu, Taiwan
Shing-Wu Tung , Information and Communications Research Lab., Industrial Technology Research Institute, Hsinchu, Taiwan
pp. 1-3

The model is not enough: Understanding energy consumption in mobile devices (Abstract)

James Bornholt , Australian National University, Australia
Todd Mytkowicz , Microsoft Research, United States
Kathryn S. McKinley , Microsoft Research, United States
pp. 1-3

Efficient, precise-restartable program execution on future multicores (Abstract)

Gagan Gupta , Department of Computer Sciences, University of Wisconsin-Madison, United States
Srinath Sridharan , Department of Computer Sciences, University of Wisconsin-Madison, United States
Gurindar S. Sohi , Department of Computer Sciences, University of Wisconsin-Madison, United States
pp. 1-3
90 ms
(Ver 3.3 (11022016))