The Community for Technology Leaders
2008 IEEE Hot Chips 20 Symposium (HCS) (2008)
Stanford, CA, USA
Aug. 24, 2008 to Aug. 26, 2008
ISBN: 978-1-4673-8871-9
TABLE OF CONTENTS

Tera-scale computing and interconnect challenges - 3D stacking considerations (Abstract)

Jerry Bautista , Microprocessor Technology Management, USA
pp. 1-34

CUDA parallel programming model (PDF)

Michael Garland , NVIDIA Research, USA
pp. 1-29

CUDA application development (Abstract)

Wen-mei Hwu , University of Illinois, Urbana-Champaign, USA
pp. 1-47

CUDA (Abstract)

pp. 1-14

Scalable parallel programming (Abstract)

John Nickolls , NVIDIA, Kevin Skadron, University of Virginia, USA
Ian Buck , NVIDIA, Kevin Skadron, University of Virginia, USA
Michael Garland , NVIDIA, Kevin Skadron, University of Virginia, USA
pp. 40-53

Message from the chair (PDF)

Don Draper , Hot Chips, USA
pp. 1-2

Gold sponsor (PDF)

pp. 1

Network based coherency: Extending a processor's coherency domain over a standard network (Abstract)

Bob Quinn , 3 Leaf Systems, USA
Isam Akkawi , 3 Leaf Systems, USA
Krishnan Subramani , 3 Leaf Systems, USA
Shahe Krakirian , 3 Leaf Systems, USA
pp. 1-22

The roofline model: A pedagogical tool for program analysis and optimization (Abstract)

Samuel Williams , University of California, Berkeley, USA
David Patterson , University of California, Berkeley, USA
Leonid Oliker , University of California, Berkeley, USA
John Shalf , Lawrence Berkeley National Laboratory, USA
Katherine Yelick , University of California, Berkeley, USA
pp. 1-71

Power-performance comparative evaluation of alternate microarchitectures (Abstract)

Rick Eickemeyer , IBM Systems and Technology Group, USA
Michael Floyd , IBM Systems and Technology Group, USA
John Griswell , IBM Systems and Technology Group, USA
Alex Mericas , IBM Systems and Technology Group, USA
Balaram Sinharoy , IBM Systems and Technology Group, USA
Pradip Bose , IBM Research Division, USA
Soraya Ghiasi , IBM Research Division, USA
Hendrik Hamann , IBM Research Division, USA
Hans Jacobson , IBM Research Division, USA
Tom Keller , IBM Research Division, USA
Victor Zyuban , IBM Research Division, USA
pp. 1-31

Making cars drive themselves (Abstract)

Sebastian Thrun , Stanford University, USA
pp. 1-86

SpursEngine™ a high-performance stream processor derived from cell/B.E.™ for media processing acceleration (Abstract)

Hiroo Hayashi , Toshiba Corporation Semiconductor Company, Advanced SoC Development Center, Japan
pp. 1-38

A 167-processor computational array for highly-efficient DSP and embedded application processing (Abstract)

Dean Truong , VLSI Computation Lab, University of California, Davis, USA
Wayne Cheng , VLSI Computation Lab, University of California, Davis, USA
Tinoosh Mohsenin , VLSI Computation Lab, University of California, Davis, USA
Zhiyi Yu , VLSI Computation Lab, University of California, Davis, USA
Toney Jacobson , VLSI Computation Lab, University of California, Davis, USA
Gouri Landge , VLSI Computation Lab, University of California, Davis, USA
Michael Meeuwsen , VLSI Computation Lab, University of California, Davis, USA
Christine Watnik , VLSI Computation Lab, University of California, Davis, USA
Paul Mejia , VLSI Computation Lab, University of California, Davis, USA
Anh Tran , VLSI Computation Lab, University of California, Davis, USA
Jeremy Webb , VLSI Computation Lab, University of California, Davis, USA
Eric Work , VLSI Computation Lab, University of California, Davis, USA
Zhibin Xiao , VLSI Computation Lab, University of California, Davis, USA
Bevan Baas , VLSI Computation Lab, University of California, Davis, USA
pp. 1-27

System architecture and applications of the PNX5100 (Abstract)

Johan G Janssen , System Architect Media Subsystems, USA
pp. 1-27

A 300-mW single-chip NTSC/ PAL television for mobile applications (Abstract)

S. Sheng , Making Television Mobile, USA
A. Abo , Making Television Mobile, USA
P. Chi , Making Television Mobile, USA
R. Contreras , Making Television Mobile, USA
R. Gupta , Making Television Mobile, USA
H. Huang , Making Television Mobile, USA
L. Lynn , Making Television Mobile, USA
E. Macdonald , Making Television Mobile, USA
K.Y. Nam , Making Television Mobile, USA
R. S. Narayanaswami , Making Television Mobile, USA
S. Stoiber , Making Television Mobile, USA
E. Su , Making Television Mobile, USA
D. Yee , Making Television Mobile, USA
pp. 1-22

Anton: A specialized ASIC for molecular dynamics (Abstract)

Martin M. Deneroff , D. E. Shaw Research, United States
David E. Shaw , D. E. Shaw Research, United States
Ron O. Dror , D. E. Shaw Research, United States
Jeffrey S. Kuskin , D. E. Shaw Research, United States
Richard H. Larson , D. E. Shaw Research, United States
John K. Salmon , D. E. Shaw Research, United States
Cliff Young , D. E. Shaw Research, United States
pp. 1-34

Anton: A specialized ASIC for molecular dynamics (Abstract)

Martin M. Deneroff , D. E. Shaw Research, United States
David E. Shaw , D. E. Shaw Research, United States
Ron O. Dror , D. E. Shaw Research, United States
Jeffrey S. Kuskin , D. E. Shaw Research, United States
Richard H. Larson , D. E. Shaw Research, United States
John K. Salmon , D. E. Shaw Research, United States
Cliff Young , D. E. Shaw Research, United States
pp. 1-34

20 years of hits & misses (PDF)

David Patterson , U.C. Berkeley, United States
pp. 1-7

Ready, fire, aim - 20 years of hits and misses at Hot Chips (PDF)

Dave Ditzel , VP Hybrid Parallel Computing, Intel Corporation, United States
pp. 1-13

MAXware: Acceleration in HPC (Abstract)

R. Dimond , Maxeler Technologies, United Kingdom
M. J. Flynn , Maxeler Technologies, United Kingdom
O. Mencer , Maxeler Technologies, United Kingdom
O. Pell , Maxeler Technologies, United Kingdom
pp. 1-26

AMD 780G (Abstract)

Niles Burbank , AMD, United States
pp. 1-19

Micro-architecture of Godson-3 multi-core processor (Abstract)

Weiwu Hu , Institute of Computing Technology (ICT), Chinese Academy of Sciences, China
Jian Wang , Institute of Computing Technology (ICT), Chinese Academy of Sciences, China
Xiang Gao , Institute of Computing Technology (ICT), Chinese Academy of Sciences, China
Yunji Chen , Institute of Computing Technology (ICT), Chinese Academy of Sciences, China
pp. 1-31

Inside Intel® Core microarchitecture (Nehalem) (Abstract)

Ronak Singhal , Intel Corporation, United States
pp. 1-25

The QFP packet processing chip set (Abstract)

Will Eatherton , Cisco Systems, Cisco Development Organization, United States
Don Steiss , Cisco Systems, Cisco Development Organization, United States
James Markevitch , Cisco Systems, Cisco Development Organization, United States
pp. 1-22

Tukwila - a quad-core Intel® Itanium® processor (Abstract)

Eric DeLano , Intel® Corporation, United States
pp. 1-29

SPARC64™ VII Fujitsu's next generation quad-core processor (Abstract)

Takumi Maruyama , LSI Development Division, Next Generation Technical Computing Unit, Fujitsu Limited, Japan
pp. 1-18
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