Proceedings. 15th IEEE VLSI Test Symposium (Cat. No.97TB100125)
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Abstract

A new testing alternative based on thermal wave propagation is proposed. Some failures, when activated, produce an increase in local power dissipation at various points. A thermal wave is generated by this increase and can be used as a test observable. In this paper, both the thermal wave and the heat sources that appear for a set of faults are characterised and a built-in sensing strategy based on differential considerations is analysed.
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